Foxconn Interconnect Technology Sustainability Profile
Foxconn Interconnect Technology, often referred to as FIT, is a leading provider of advanced interconnect solutions headquartered in Taiwan (TW). Established in 2015, the company has rapidly expanded its operations across major regions, including Asia, Europe, and North America, solidifying its presence in the global electronics industry. Specialising in high-quality connectors, cable assemblies, and other interconnect products, FIT distinguishes itself through innovative design and manufacturing processes. The company has achieved significant milestones, including partnerships with major technology firms, which have bolstered its market position. With a commitment to excellence and a focus on research and development, Foxconn Interconnect Technology continues to set industry standards, making it a key player in the interconnect solutions sector. Its dedication to quality and customer satisfaction has earned it a reputation for reliability and performance in a competitive marketplace.
DitchCarbon Score
How does Foxconn Interconnect Technology's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Industry Average
Mean score of companies in the Electricity from Other Sources industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
Industry Benchmark
Foxconn Interconnect Technology's score of 67 is higher than 83% of the industry. This can give you a sense of how well the company is doing compared to its peers.
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Foxconn Interconnect Technology's reported carbon emissions
In 2023, Foxconn Interconnect Technology (FIT) reported total carbon emissions of approximately 13158450 kg CO2e for Scope 1, 243883040 kg CO2e for Scope 2, and 257041490 kg CO2e for Scope 3 emissions. This data reflects a comprehensive approach to emissions reporting, including both direct and indirect emissions across all three scopes. Comparatively, in 2022, the company recorded emissions of about 14873200 kg CO2e for Scope 1, 245927630 kg CO2e for Scope 2, and 260800830 kg CO2e for Scope 3. The slight decrease in Scope 1 emissions from 2022 to 2023 indicates a potential focus on reducing direct emissions. Foxconn Interconnect Technology's emissions data is cascaded from its parent company, FIT Hon Teng Limited, which is part of the broader Hon Hai Precision Industry Co., Ltd. corporate family. This relationship influences their climate commitments and reporting practices. Despite the detailed emissions reporting, there are currently no specific reduction targets or climate pledges documented for Foxconn Interconnect Technology. The absence of such initiatives suggests a need for enhanced climate strategies within the organisation to align with industry standards and expectations for sustainability.
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| 2020 | 2021 | 2022 | 2023 | |
|---|---|---|---|---|
| Scope 1 | 7,512,860 | 0,000,000 | 00,000,000 | 00,000,000 |
| Scope 2 | 338,332,340 | 000,000,000 | 000,000,000 | 000,000,000 |
| Scope 3 | - | 000,000,000 | 000,000,000 | 000,000,000 |
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Foxconn Interconnect Technology's Climate Goals (2030 & 2050)
Climate goals typically focus on 2030 interim targets and 2050 net-zero commitments, aligned with global frameworks like the Paris Agreement and Science Based Targets initiative (SBTi) to ensure alignment with global climate goals.
Foxconn Interconnect Technology has not publicly committed to specific 2030 or 2050 climate goals through the major frameworks we track. Companies often set interim 2030 targets and long-term 2050 net-zero goals to demonstrate measurable progress toward decarbonization.
