Winbond
Winbond Electronics Corporation, commonly known as Winbond, is a leading semiconductor manufacturer headquartered in Taiwan (TW). Established in 1987, the company has made significant strides in the memory IC industry, specialising in DRAM and Flash memory products. With a strong presence in Asia, Europe, and North America, Winbond serves a diverse range of sectors, including consumer electronics, automotive, and industrial applications. Winbond's core offerings include a variety of memory solutions, such as Serial NOR Flash, DRAM, and specialty memory products, distinguished by their reliability and performance. The company has achieved notable market recognition, positioning itself as a key player in the global semiconductor landscape. With a commitment to innovation and quality, Winbond continues to drive advancements in memory technology, catering to the evolving needs of its customers.
DitchCarbon Score
How does Winbond's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Industry Average
Mean score of companies in the Electrical Machinery Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
Industry Benchmark
Winbond's score of 32 is higher than 88% of the industry. This can give you a sense of how well the company is doing compared to its peers.
Winbond's reported carbon emissions
In 2023, Winbond Electronics Corporation reported total carbon emissions of approximately 356,535,000 kg CO2e, comprising 44,149,000 kg CO2e from Scope 1 and 356,535,000 kg CO2e from Scope 2 emissions. Additionally, Scope 3 emissions were significant, amounting to about 454,221,000 kg CO2e, which included contributions from business travel, employee commuting, purchased goods and services, and waste generated in operations. Winbond has demonstrated a commitment to climate action by pledging to achieve net-zero emissions. The company is actively engaged in initiatives to reduce its carbon footprint, although specific reduction targets have not been disclosed. The organisation is classified under the semiconductor sector and is headquartered in Taiwan (TW). Over the years, Winbond's emissions have shown fluctuations, with total emissions recorded at approximately 353,535,000 kg CO2e in 2022 and 331,317,000 kg CO2e in 2020. The company continues to focus on improving its emissions intensity, with reported figures indicating a decrease in greenhouse gas emissions per product unit over time. Winbond's ongoing efforts reflect a broader industry trend towards sustainability and responsible environmental stewardship, aligning with global climate commitments.
Unlock detailed emissions data
Access structured emissions data, company-specific emission factors, and source documents
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | |
|---|---|---|---|---|---|---|---|
| Scope 1 | 62,318,000 | 00,000,000 | 000,000,000 | 00,000,000 | 00,000,000 | 00,000,000 | 00,000,000 |
| Scope 2 | 250,859,000 | 000,000,000 | 000,000,000 | 000,000,000 | 000,000,000 | 000,000,000 | 000,000,000 |
| Scope 3 | - | - | - | - | - | 000,000,000 | 000,000,000 |
Industry emissions intensity
Location emissions intensity
Reduction initiatives & disclosure networks
Companies disclose and commit to reducing emissions to show they are serious about reducing emissions impact over time. They can also help a company track its progress over time.
Winbond is committed to some reduction initiatives we track. This may change over time as the company engages with new initiatives or updates its commitments. DitchCarbon will update this information as it becomes available.
