Winbond Electronics Corporation, commonly known as Winbond, is a leading semiconductor manufacturer headquartered in Taiwan (TW). Established in 1987, the company has made significant strides in the memory IC industry, specialising in DRAM and Flash memory products. With a strong presence in Asia, Europe, and North America, Winbond serves a diverse range of sectors, including consumer electronics, automotive, and industrial applications. Winbond's core offerings include a variety of memory solutions, such as Serial NOR Flash, DRAM, and specialty memory products, distinguished by their reliability and performance. The company has achieved notable market recognition, positioning itself as a key player in the global semiconductor landscape. With a commitment to innovation and quality, Winbond continues to drive advancements in memory technology, catering to the evolving needs of its customers.
How does Winbond's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Mean score of companies in the Electrical Machinery Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
Winbond's score of 49 is higher than 93% of the industry. This can give you a sense of how well the company is doing compared to its peers.
In 2023, Winbond Electronics Corporation reported total carbon emissions of approximately 356,535,000 kg CO2e. This figure includes 44,149,000 kg CO2e from Scope 1 emissions, which are direct emissions from owned or controlled sources, and 356,535,000 kg CO2e from Scope 2 emissions, representing indirect emissions from the generation of purchased electricity, steam, heating, and cooling. Additionally, Scope 3 emissions totalled about 454,221,000 kg CO2e, encompassing various categories such as business travel (340,000 kg CO2e) and purchased goods and services (206,836,000 kg CO2e). Winbond has set ambitious climate commitments, aiming for net-zero emissions by 2050. The company has established a structured approach to achieving this goal, with short-term targets set for 2030 and medium-term targets for 2040. These commitments encompass all scopes of emissions, reflecting a comprehensive strategy to reduce their carbon footprint across their operations. In comparison, the previous year's emissions in 2022 were approximately 353,535,000 kg CO2e, indicating a slight increase in total emissions year-on-year. Winbond's ongoing efforts to monitor and reduce emissions are crucial as they navigate the challenges of the semiconductor industry, which is known for its significant energy consumption and associated greenhouse gas emissions.
Access structured emissions data, company-specific emission factors, and source documents
2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | |
---|---|---|---|---|---|---|---|
Scope 1 | 62,318,000 | 00,000,000 | 000,000,000 | 00,000,000 | 00,000,000 | 00,000,000 | 00,000,000 |
Scope 2 | 250,859,000 | 000,000,000 | 000,000,000 | 000,000,000 | 000,000,000 | 000,000,000 | 000,000,000 |
Scope 3 | - | - | - | - | - | 000,000,000 | 000,000,000 |
Companies disclose and commit to reducing emissions to show they are serious about reducing emissions impact over time. They can also help a company track its progress over time.
Winbond is participating in some of the initiatives that we track. This may change over time as the company engages with new initiatives or updates its commitments. DitchCarbon will update this information as it becomes available.