Winbond Electronics Corporation, commonly known as Winbond, is a leading semiconductor manufacturer headquartered in Taiwan (TW). Established in 1987, the company has made significant strides in the memory IC industry, specialising in DRAM and Flash memory products. With a strong presence in Asia, Europe, and North America, Winbond serves a diverse range of sectors, including consumer electronics, automotive, and industrial applications. Winbond's core offerings include a variety of memory solutions, such as Serial NOR Flash, DRAM, and specialty memory products, distinguished by their reliability and performance. The company has achieved notable market recognition, positioning itself as a key player in the global semiconductor landscape. With a commitment to innovation and quality, Winbond continues to drive advancements in memory technology, catering to the evolving needs of its customers.
How does Winbond's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Mean score of companies in the Electrical Machinery Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
Winbond's score of 49 is higher than 68% of the industry. This can give you a sense of how well the company is doing compared to its peers.
In 2023, Winbond Electronics Corporation, headquartered in Taiwan (TW), reported significant carbon emissions, totalling approximately 44149000 kg CO2e for Scope 1 and about 356535000 kg CO2e for Scope 2. This brings their total emissions for the year to around 400000000 kg CO2e when including Scope 3 emissions, which amounted to approximately 454221000 kg CO2e globally. Winbond has set ambitious climate commitments, aiming for net-zero emissions by 2050. They have established short-term (by 2030) and medium-term (by 2040) targets as part of their sustainability strategy. These targets encompass all scopes of emissions, reflecting a comprehensive approach to reducing their carbon footprint. The company is committed to the Science Based Targets initiative (SBTi), with their targets classified as net-zero and committed to achieving these goals by 2050. Winbond's emissions data is not cascaded from any parent organization, indicating that their climate commitments and performance are independently reported. Overall, Winbond's proactive stance on climate action and their clear reduction targets position them as a responsible player in the semiconductor industry, aligning with global efforts to combat climate change.
Access structured emissions data, company-specific emission factors, and source documents
| 2012 | 2013 | 2014 | 2015 | 2016 | 2020 | 2021 | 2022 | 2023 | |
|---|---|---|---|---|---|---|---|---|---|
| Scope 1 | 42,928,000 | 00,000,000 | 00,000,000 | 00,000,000 | 00,000,000 | 00,000,000 | 00,000,000 | 00,000,000 | 00,000,000 | 
| Scope 2 | 169,808,000 | 000,000,000 | 000,000,000 | 000,000,000 | 000,000,000 | - | - | 000,000,000 | 000,000,000 | 
| Scope 3 | - | - | - | - | - | - | - | 000,000,000 | 000,000,000 | 
Winbond's Scope 3 emissions, which increased by 2% last year and increased by approximately 2% since 2022, demonstrating supply chain emissions tracking. Most of their carbon footprint comes from suppliers and value chain emissions, with Scope 3 emissions accounting for 53% of total emissions under the GHG Protocol, with "Purchased Goods and Services" being the largest emissions source at 46% of Scope 3 emissions.
Climate goals typically focus on 2030 interim targets and 2050 net-zero commitments, aligned with global frameworks like the Paris Agreement and Science Based Targets initiative (SBTi) to ensure alignment with global climate goals.
Winbond has established climate goals through participation in recognized frameworks and target-setting initiatives. Companies often set interim 2030 targets and long-term 2050 net-zero goals to demonstrate measurable progress toward decarbonization.
