China Wafer Level CSP Co., Ltd., commonly referred to as WLCSP, is a leading player in the semiconductor industry, headquartered in China (CN). Established in 2005, the company has rapidly evolved, focusing on wafer-level chip-scale packaging (WLCSP) solutions that cater to a diverse range of applications, including consumer electronics and automotive sectors. With a strong operational presence across Asia and beyond, WLCSP is renowned for its innovative packaging technologies that enhance performance while minimising size. The company’s core offerings include advanced packaging services that stand out due to their precision and reliability. Recognised for its commitment to quality, China Wafer Level CSP Co., Ltd. has achieved significant milestones, solidifying its position as a trusted partner in the global semiconductor market.
How does China Wafer Level CSP Co., Ltd.'s carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Mean score of companies in the Communication Equipment Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
China Wafer Level CSP Co., Ltd.'s score of 22 is lower than 77% of the industry. This can give you a sense of how well the company is doing compared to its peers.
China Wafer Level CSP Co., Ltd., headquartered in CN, currently does not report any specific carbon emissions data, as indicated by the absence of emissions figures in kg CO2e. Furthermore, the company has not established any documented reduction targets or climate pledges, which suggests a lack of formal commitments to reducing carbon emissions at this time. As there are no emissions data or reduction initiatives available, it is unclear how the company is addressing climate change or its carbon footprint. In the broader industry context, many companies are increasingly adopting science-based targets and sustainability initiatives to mitigate their environmental impact. However, without specific commitments or data, it is difficult to assess China Wafer Level CSP Co., Ltd.'s position in this regard.
Climate goals typically focus on 2030 interim targets and 2050 net-zero commitments, aligned with global frameworks like the Paris Agreement and Science Based Targets initiative (SBTi) to ensure alignment with global climate goals.
China Wafer Level CSP Co., Ltd. has not publicly committed to specific 2030 or 2050 climate goals through the major frameworks we track. Companies often set interim 2030 targets and long-term 2050 net-zero goals to demonstrate measurable progress toward decarbonization.
