China Wafer Level CSP Co., Ltd., commonly referred to as WLCSP, is a leading player in the semiconductor industry, headquartered in China (CN). Established in 2005, the company has rapidly evolved, focusing on wafer-level chip-scale packaging (WLCSP) solutions that cater to a diverse range of applications, including consumer electronics and automotive sectors. With a strong operational presence across Asia and beyond, WLCSP is renowned for its innovative packaging technologies that enhance performance while minimising size. The company’s core offerings include advanced packaging services that stand out due to their precision and reliability. Recognised for its commitment to quality, China Wafer Level CSP Co., Ltd. has achieved significant milestones, solidifying its position as a trusted partner in the global semiconductor market.
How does China Wafer Level CSP Co., Ltd.'s carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Mean score of companies in the Communication Equipment Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
China Wafer Level CSP Co., Ltd.'s score of 22 is lower than 76% of the industry. This can give you a sense of how well the company is doing compared to its peers.
China Wafer Level CSP Co., Ltd., headquartered in CN, currently does not report any carbon emissions data, as indicated by the absence of specific figures. Consequently, there are no recorded emissions totals for Scope 1, Scope 2, or Scope 3. The company has not established any documented reduction targets or climate pledges, which suggests a lack of formal commitments to reducing carbon emissions at this time. Without available data or initiatives, it is unclear how China Wafer Level CSP Co., Ltd. aligns with industry standards for climate action. As the company does not inherit emissions data from a parent organisation, all information is based solely on its own reporting. In the context of the semiconductor industry, where many companies are increasingly focusing on sustainability and emissions reduction, China Wafer Level CSP Co., Ltd. may need to consider developing a comprehensive climate strategy to remain competitive and responsible in addressing climate change.
Climate goals typically focus on 2030 interim targets and 2050 net-zero commitments, aligned with global frameworks like the Paris Agreement and Science Based Targets initiative (SBTi) to ensure alignment with global climate goals.
China Wafer Level CSP Co., Ltd. has not publicly committed to specific 2030 or 2050 climate goals through the major frameworks we track. Companies often set interim 2030 targets and long-term 2050 net-zero goals to demonstrate measurable progress toward decarbonization.


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