Public Profile

China Wafer Level CSP Co., Ltd.

China Wafer Level CSP Co., Ltd., commonly referred to as WLCSP, is a leading player in the semiconductor industry, headquartered in China (CN). Established in 2005, the company has rapidly evolved, focusing on wafer-level chip-scale packaging (WLCSP) solutions that cater to a diverse range of applications, including consumer electronics and automotive sectors. With a strong operational presence across Asia and beyond, WLCSP is renowned for its innovative packaging technologies that enhance performance while minimising size. The company’s core offerings include advanced packaging services that stand out due to their precision and reliability. Recognised for its commitment to quality, China Wafer Level CSP Co., Ltd. has achieved significant milestones, solidifying its position as a trusted partner in the global semiconductor market.

DitchCarbon Score

How does China Wafer Level CSP Co., Ltd.'s carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.

15

Industry Average

Mean score of companies in the Communication Equipment Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.

2

Industry Benchmark

China Wafer Level CSP Co., Ltd.'s score of 15 is higher than 59% of the industry. This can give you a sense of how well the company is doing compared to its peers.

59%

China Wafer Level CSP Co., Ltd.'s reported carbon emissions

China Wafer Level CSP Co., Ltd., headquartered in CN, currently does not have available carbon emissions data for recent years. As a result, specific figures regarding their carbon footprint, including Scope 1, 2, or 3 emissions, are not provided. In the absence of concrete emissions data, it is important to note that the company has not outlined any specific reduction targets or climate commitments. This lack of publicly available information may suggest that the company is still in the early stages of developing a comprehensive climate strategy or reporting framework. As the semiconductor industry increasingly prioritises sustainability, it is essential for companies like China Wafer Level CSP Co., Ltd. to establish clear climate commitments and reduction initiatives to align with global efforts to mitigate climate change.

Industry emissions intensity

Very low
Low
Medium
High
Very high
Some industries are more carbon intensive than others. China Wafer Level CSP Co., Ltd.'s primary industry is Radio, television and communication equipment and apparatus (32), which is low in terms of carbon intensity compared to other industries.

Location emissions intensity

Very low
Low
Medium
High
Very high
The carbon intensity of the energy grid powering a company's primary operations has a strong influence on its overall carbon footprint. China Wafer Level CSP Co., Ltd. is headquartered in CN, which we do not have grid emissions data for.

Reduction initiatives & disclosure networks

Companies disclose and commit to reducing emissions to show they are serious about reducing emissions impact over time. They can also help a company track its progress over time.

China Wafer Level CSP Co., Ltd. is not committed to any reduction initiatives we track. This may change over time as the company engages with new initiatives or updates its commitments. DitchCarbon will update this information as it becomes available.

Science Based Targets Initiative
Carbon Disclosure Project
The Climate Pledge
UN Global Compact
Carbon Disclosure Project
The Climate Pledge
UN Global Compact

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Where does DitchCarbon data come from?

Discover our data-driven methodology for measuring corporate climate action and benchmarking against industry peers