Taiwan IC Packaging Corporation
Taiwan IC Packaging Corporation, commonly referred to as TICP, is a leading player in the semiconductor packaging industry, headquartered in Taiwan (TW). Established in 1997, TICP has consistently evolved, marking significant milestones in advanced packaging technologies and solutions. The company operates primarily in Taiwan and other key regions, focusing on innovative packaging services that cater to the growing demands of the electronics market. TICP's core offerings include a range of advanced integrated circuit (IC) packaging solutions, known for their reliability and efficiency. The company distinguishes itself through its commitment to quality and cutting-edge technology, ensuring optimal performance for its clients. With a strong market position, TICP has garnered recognition for its contributions to the semiconductor sector, solidifying its reputation as a trusted partner for leading technology firms.
DitchCarbon Score
How does Taiwan IC Packaging Corporation's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Industry Average
Mean score of companies in the Business Services industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
Industry Benchmark
Taiwan IC Packaging Corporation's score of 27 is higher than 55% of the industry. This can give you a sense of how well the company is doing compared to its peers.
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Taiwan IC Packaging Corporation's reported carbon emissions
In 2023, Taiwan IC Packaging Corporation (TIPC), headquartered in Taiwan (TW), reported total carbon emissions of approximately 17,678,000 kg CO2e, encompassing Scope 1 and Scope 2 emissions. This figure reflects a significant reduction from previous years, particularly from 2021, when the combined Scope 1 and Scope 2 emissions were about 1,011,239,000 kg CO2e. For 2022, TIPC disclosed emissions of approximately 19,125,300 kg CO2e, with Scope 1 emissions at about 50,500 kg CO2e and Scope 2 emissions at approximately 19,074,800 kg CO2e. The data indicates a trend towards decreasing emissions, aligning with the company's long-term climate commitments. TIPC has set ambitious carbon reduction targets, aiming for a 20% reduction in emissions by 2025 and a 35% reduction by 2030, using 2007 as the baseline year. The ultimate goal is to achieve carbon neutrality by 2050. These targets apply to both Scope 1 and Scope 2 emissions, demonstrating TIPC's commitment to addressing its carbon footprint in line with international climate trends. The company has not disclosed any Scope 3 emissions data, which typically includes indirect emissions from the supply chain and product use. However, TIPC's proactive approach to emissions reduction and its clear targets position it as a responsible player in the semiconductor packaging industry, contributing to broader climate action efforts.
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| 2020 | 2021 | 2022 | 2023 | |
|---|---|---|---|---|
| Scope 1 | 2,602,355,000 | 0,000,000,000 | 00,000 | - |
| Scope 2 | 3,318,694,000 | 0,000,000,000 | 00,000,000 | - |
| Scope 3 | - | 00,000,000,000 | - | - |
Industry emissions intensity
Location emissions intensity
Reduction initiatives & disclosure networks
Companies disclose and commit to reducing emissions to show they are serious about reducing emissions impact over time. They can also help a company track its progress over time.
Taiwan IC Packaging Corporation is not participating in any of the initiatives that we track. This may change over time as the company engages with new initiatives or updates its commitments. DitchCarbon will update this information as it becomes available.
