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Chipbond Technology Corporation, headquartered in Taiwan (TW), is a prominent player in the radio, television, and communication equipment and apparatus industry. Founded in 1999, the company has established itself as a leader in the development and manufacturing of advanced semiconductor packaging solutions, particularly for the optoelectronics and communication sectors.
With a focus on high-quality products such as chip-on-glass (COG) and chip-on-board (COB) technologies, Chipbond distinguishes itself through its innovative approaches and commitment to precision. The company serves a global market, with significant operations across Asia and beyond, catering to the growing demand for cutting-edge communication devices.
Chipbond's dedication to research and development has led to numerous industry accolades, solidifying its position as a trusted partner for major technology firms. As the communication landscape evolves, Chipbond continues to push the boundaries of technology, ensuring its products meet the highest standards of performance and reliability.
-22 vs industry average
Chipbond Technology Corporation’s score of 15 is lower than 11% of the industry. This can give you a sense of how well the company is doing compared to its peers.
Communication Equipment Manufacturing has below-average carbon intensity
The Communication Equipment Manufacturing industry has reduced its overall emissions by 30% since 2018
Scope 3 accounts for ••• of total emissions.
Chipbond Technology Corporation, headquartered in TW and operating in the Radio, television, and communication equipment and apparatus industry, reported its 2022 carbon emissions at approximately 206,431,791.9 kg CO2e. This total includes Scope 1 emissions of approximately 11,261,682.4 kg CO2e, Scope 2 emissions of approximately 155,473,883.0 kg CO2e, and Scope 3 emissions of approximately 39,693,306.5 kg CO2e. In the prior year, 2021, the company's Scope 1 emissions were approximately 10,897,330.1 kg CO2e, Scope 2 emissions were approximately 160,414,356.6 kg CO2e, and Scope 3 emissions were approximately 41,252,802.6 kg CO2e. Chipbond Technology Corporation has not publicly disclosed any specific carbon reduction targets, nor is it a signatory to the Science Based Targets initiative (SBTi) or other major climate commitments.
No climate goals have been disclosed for Chipbond Technology Corporation yet.
No scope 3 category breakdown has been disclosed yet.


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