Chipbond Technology Corporation
Chipbond Technology Corporation, headquartered in Taiwan (TW), is a leading player in the semiconductor industry, specialising in advanced packaging and testing services. Founded in 1997, the company has established itself as a key provider of innovative solutions for integrated circuits, particularly in the areas of flip chip and wafer-level packaging. With a strong presence in major operational regions across Asia, Chipbond is renowned for its commitment to quality and technological advancement. The company’s core offerings include high-performance semiconductor packaging and testing services, which are distinguished by their reliability and efficiency. Chipbond's strategic focus on research and development has positioned it as a trusted partner for global clients, contributing to its notable achievements in the competitive semiconductor market. As a result, Chipbond Technology Corporation continues to drive innovation and excellence in the ever-evolving landscape of semiconductor technology.
DitchCarbon Score
How does Chipbond Technology Corporation's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Industry Average
Mean score of companies in the Communication Equipment Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
Industry Benchmark
Chipbond Technology Corporation's score of 54 is higher than 76% of the industry. This can give you a sense of how well the company is doing compared to its peers.
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Chipbond Technology Corporation's reported carbon emissions
In 2024, Chipbond Technology Corporation reported total carbon emissions of approximately 77,605,280 kg CO2e. This figure includes 512,550 kg CO2e from Scope 1 emissions, 77,092,730 kg CO2e from Scope 2 emissions, and 60,406,770 kg CO2e from Scope 3 emissions. In comparison, the 2023 emissions were about 84,403,600 kg CO2e, with Scope 1 at 588,510 kg CO2e, Scope 2 at 83,815,090 kg CO2e, and Scope 3 at 56,411,420 kg CO2e. Chipbond has set a target to reduce its Scope 1 and Scope 2 emissions by 6% by 2030, relative to a baseline year of 2022, which translates to a reduction of approximately 1% per year. This commitment reflects the company's proactive approach to mitigating its carbon footprint and aligns with industry standards for climate action. The emissions data is not cascaded from any parent organization, indicating that Chipbond Technology Corporation independently reports its emissions and climate commitments.
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| 2021 | 2022 | 2023 | 2024 | |
|---|---|---|---|---|
| Scope 1 | 10,897,330.1 | 00,000,000.0 | 000,000 | 000,000 |
| Scope 2 | 160,414,356.6 | 000,000,000 | 00,000,000 | 00,000,000 |
| Scope 3 | 41,252,802.6 | 00,000,000.0 | 00,000,000 | 00,000,000 |
Industry emissions intensity
Location emissions intensity
Reduction initiatives & disclosure networks
Companies disclose and commit to reducing emissions to show they are serious about reducing emissions impact over time. They can also help a company track its progress over time.
Chipbond Technology Corporation is not participating in any of the initiatives that we track. This may change over time as the company engages with new initiatives or updates its commitments. DitchCarbon will update this information as it becomes available.
