Chipbond Technology Corporation
Chipbond Technology Corporation, headquartered in Taiwan (TW), is a prominent player in the radio, television, and communication equipment and apparatus industry. Founded in 1999, the company has established itself as a leader in the development and manufacturing of advanced semiconductor packaging solutions, particularly for the optoelectronics and communication sectors.
With a focus on high-quality products such as chip-on-glass (COG) and chip-on-board (COB) technologies, Chipbond distinguishes itself through its innovative approaches and commitment to precision. The company serves a global market, with significant operations across Asia and beyond, catering to the growing demand for cutting-edge communication devices.
Chipbond's dedication to research and development has led to numerous industry accolades, solidifying its position as a trusted partner for major technology firms. As the communication landscape evolves, Chipbond continues to push the boundaries of technology, ensuring its products meet the highest standards of performance and reliability.
-1 vs industry average
Chipbond Technology Corporation’s score of 34 is lower than 49% of the industry. This can give you a sense of how well the company is doing compared to its peers.
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Industry Intensity
Communication Equipment Manufacturing has below-average carbon intensity
Industry performance
The Communication Equipment Manufacturing industry has reduced its overall emissions by 24% since 2019
Emissions trajectory 2020 – 2027
Reported emissions
Scope 3 accounts for ••• of total emissions.
Chipbond Technology Corporation's reported carbon emissions
Chipbond Technology Corporation, a company in the Radio, television and communication equipment and apparatus (32) industry headquartered in Taiwan (TW), reported its carbon emissions for recent years. In 2024, the company's total reported emissions were approximately 77.6 million kg CO2e. This figure comprises roughly 512,550 kg CO2e from Scope 1, approximately 77.1 million kg CO2e from Scope 2, and about 60.4 million kg CO2e from Scope 3. For 2023, Chipbond Technology Corporation's total emissions were approximately 84.4 million kg CO2e. This included about 588,510 kg CO2e for Scope 1, approximately 83.8 million kg CO2e for Scope 2, and around 56.4 million kg CO2e for Scope 3. In 2022, the company's total emissions stood at approximately 166.6 million kg CO2e. This consisted of roughly 11.3 million kg CO2e from Scope 1, approximately 155.5 million kg CO2e from Scope 2, and about 39.7 million kg CO2e from Scope 3. For 2021, Chipbond Technology Corporation's total emissions were approximately 222.5 million kg CO2e. This included approximately 10.9 million kg CO2e for Scope 1, about 160.4 million kg CO2e for Scope 2, and roughly 41.3 million kg CO2e for Scope 3. Chipbond Technology Corporation has set climate commitments, aiming for a 6% reduction in combined Scope 1 and Scope 2 carbon emissions by 2030, compared to the 2022 baseline year. This equates to an anticipated annual reduction of 1%. The company's reporting indicates it is on track to meet its two-year reduction goals related to this target.
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Chipbond Technology Corporation’s Climate Goals (2030 & 2050)
2 goals2030
6% reduction in Scope 1
It is expected that by 2030, the scope 1 and scope 2 carbon emission reduction will be 6% (minus 1% per year) lower than that of the baselin…
2030
62% reduction in total GHG
Vs 2019 baseline. Validated by SBTi. Includes full supply chain.
2040
50% reduction in Scope 3 intensity
Across purchased goods and services and logistics.
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Scope 3 top emissions categories
No scope 3 category breakdown has been disclosed yet.
Emissions comparison with industry peers
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Chipbond Technology Corporation
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