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Chipbond Technology Corporation
Communication Equipment ManufacturingTaiwan
Last verified 1 month agochipbond.com.tw
Chipbond Technology Corporation, headquartered in Taiwan (TW), is a prominent player in the radio, television, and communication equipment and apparatus industry. Founded in 1999, the company has established itself as a leader in the development and manufacturing of advanced semiconductor packaging solutions, particularly for the optoelectronics and communication sectors.
With a focus on high-quality products such as chip-on-glass (COG) and chip-on-board (COB) technologies, Chipbond distinguishes itself through its innovative approaches and commitment to precision. The company serves a global market, with significant operations across Asia and beyond, catering to the growing demand for cutting-edge communication devices.
Chipbond's dedication to research and development has led to numerous industry accolades, solidifying its position as a trusted partner for major technology firms. As the communication landscape evolves, Chipbond continues to push the boundaries of technology, ensuring its products meet the highest standards of performance and reliability.
15
DitchCarbon score
-22 vs industry average
Chipbond Technology Corporation’s score of 15 is lower than 11% of the industry. This can give you a sense of how well the company is doing compared to its peers.
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Industry Intensity
Low
Communication Equipment Manufacturing has below-average carbon intensity
Industry performance
0.274
20182025
The Communication Equipment Manufacturing industry has reduced its overall emissions by 30% since 2018
Emissions trajectory 2020 – 2025
Reported emissions
Scope 1
•••kg CO₂e
Scope 2
•••kg CO₂e
Scope 3
•••kg CO₂e
Total reported
•••kg CO₂e
Scope 3 accounts for ••• of total emissions.
Chipbond Technology Corporation's reported carbon emissions
Chipbond Technology Corporation, headquartered in Taiwan and operating in the Radio, Television and Communication Equipment and Apparatus industry, reported total gross carbon emissions of about 77,605,280 kg CO2e in 2024. This figure includes approximately 512,550 kg CO2e from Scope 1 emissions, 77,092,730 kg CO2e from Scope 2 emissions, and 60,406,770 kg CO2e from Scope 3 emissions.
In 2023, the company's total gross carbon emissions were approximately 84,403,600 kg CO2e, comprising around 588,510 kg CO2e from Scope 1, 83,815,090 kg CO2e from Scope 2, and 56,411,420 kg CO2e from Scope 3.
Looking back to 2022, Chipbond Technology Corporation's Scope 1 emissions were approximately 11,261,682.4 kg CO2e, Scope 2 emissions were about 155,473,883 kg CO2e, and Scope 3 emissions totalled approximately 39,693,306.5 kg CO2e. In 2021, Scope 1 emissions were around 10,897,330.1 kg CO2e, Scope 2 emissions were approximately 160,414,356.6 kg CO2e, and Scope 3 emissions were about 41,252,802.6 kg CO2e.
Chipbond Technology Corporation has set a near-term absolute reduction target to decrease its Scope 1 and Scope 2 carbon emissions by 6% by 2030, using 2022 as the baseline year. This target aims for a 1% annual reduction.
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Chipbond Technology Corporation’s Climate Goals (2030 & 2050)
No climate goals have been disclosed for Chipbond Technology Corporation yet.
Scope 3 top emissions categories
No scope 3 category breakdown has been disclosed yet.
Climate initiatives
Science Based Targets Initiative
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Not active
Carbon Disclosure Project
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Not active
The Climate Pledge
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Not active
UN Global Compact Climate Champions initiative
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Not active
RE 100
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Not active
Climate Action 100
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Emissions comparison with industry peers
View similar organisationsCompanyCountryIndustryLast updatedScoreDetails
Chipbond Technology Corporation1 month ago
15
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