Chipbond Technology Corporation
Chipbond Technology Corporation, headquartered in Taiwan (TW), is a prominent player in the radio, television, and communication equipment and apparatus industry. Founded in 1999, the company has established itself as a leader in the development and manufacturing of advanced semiconductor packaging solutions, particularly for the optoelectronics and communication sectors.
With a focus on high-quality products such as chip-on-glass (COG) and chip-on-board (COB) technologies, Chipbond distinguishes itself through its innovative approaches and commitment to precision. The company serves a global market, with significant operations across Asia and beyond, catering to the growing demand for cutting-edge communication devices.
Chipbond's dedication to research and development has led to numerous industry accolades, solidifying its position as a trusted partner for major technology firms. As the communication landscape evolves, Chipbond continues to push the boundaries of technology, ensuring its products meet the highest standards of performance and reliability.
+1 vs industry average
Chipbond Technology Corporation’s score of 36 is higher than 51% of the industry. This can give you a sense of how well the company is doing compared to its peers.
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Industry Intensity
Communication Equipment Manufacturing has below-average carbon intensity
Industry performance
The Communication Equipment Manufacturing industry has reduced its overall emissions by 24% since 2019
Emissions trajectory 2020 – 2027
Reported emissions
Scope 3 accounts for ••• of total emissions.
Chipbond Technology Corporation's reported carbon emissions
Chipbond Technology Corporation, based in Taiwan and operating within the radio, television, and communication equipment industry, reported a total of approximately 77.6 billion kg CO2e in greenhouse gas emissions for 2024. This figure encompasses Scope 1, Scope 2, and Scope 3 emissions.
For 2023, Chipbond Technology Corporation's total emissions were approximately 84.4 billion kg CO2e. Their Scope 1 emissions for 2023 totalled about 588,510 kg CO2e, with Scope 2 emissions at approximately 83.8 billion kg CO2e, and Scope 3 emissions at about 56.4 billion kg CO2e.
In 2022, the company's total emissions stood at approximately 77.6 billion kg CO2e. Scope 1 emissions were around 11.3 million kg CO2e, while Scope 2 emissions reached approximately 155.5 billion kg CO2e, and Scope 3 emissions were about 39.7 billion kg CO2e.
Chipbond Technology Corporation has established a near-term climate commitment to reduce its Scope 1 and Scope 2 carbon emissions by 6% by 2030, compared to a 2022 baseline. This target translates to an annual reduction of 1%. The company is currently on track for its two-year progress towards this goal.
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Chipbond Technology Corporation’s Climate Goals (2030 & 2050)
2 goals2030
6% reduction in Scope 1
It is expected that by 2030, the scope 1 and scope 2 carbon emission reduction will be 6% (minus 1% per year) lower than that of the baselin…
2030
62% reduction in total GHG
Vs 2019 baseline. Validated by SBTi. Includes full supply chain.
2040
50% reduction in Scope 3 intensity
Across purchased goods and services and logistics.
See all 2 climate goals
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Scope 3 top emissions categories
No scope 3 category breakdown has been disclosed yet.
Emissions comparison with industry peers
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Chipbond Technology Corporation
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