Chipbond Technology Corporation
Chipbond Technology Corporation, headquartered in Taiwan (TW), is a leading player in the semiconductor industry, specialising in advanced packaging and testing services. Founded in 1997, the company has established itself as a key provider of innovative solutions for integrated circuits, particularly in the areas of flip chip and wafer-level packaging. With a strong presence in major operational regions across Asia, Chipbond is renowned for its commitment to quality and technological advancement. The company’s core offerings include high-performance semiconductor packaging and testing services, which are distinguished by their reliability and efficiency. Chipbond's strategic focus on research and development has positioned it as a trusted partner for global clients, contributing to its notable achievements in the competitive semiconductor market. As a result, Chipbond Technology Corporation continues to drive innovation and excellence in the ever-evolving landscape of semiconductor technology.
DitchCarbon Score
How does Chipbond Technology Corporation's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.
Industry Average
Mean score of companies in the Communication Equipment Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.
Industry Benchmark
Chipbond Technology Corporation's score of 52 is higher than 75% of the industry. This can give you a sense of how well the company is doing compared to its peers.
Let us know if this data was useful to you
Chipbond Technology Corporation's reported carbon emissions
In 2024, Chipbond Technology Corporation reported total carbon emissions of approximately 28,010,295.2 kg CO2e. This figure includes Scope 1 emissions of about 1,432,903.6 kg CO2e, Scope 2 emissions of approximately 19,171,976.0 kg CO2e, and Scope 3 emissions of about 7,405,415.6 kg CO2e. The previous year, 2023, saw total emissions of around 26,955,090.1 kg CO2e, with Scope 1 at about 1,441,279.5 kg CO2e, Scope 2 at approximately 18,601,927.8 kg CO2e, and Scope 3 at about 6,911,882.8 kg CO2e. Chipbond has set a near-term reduction target aiming for a 6% decrease in Scope 1 and Scope 2 emissions by 2030, relative to a baseline year of 2022. This translates to a reduction of about 1% per year. The company is currently on track to meet this target, demonstrating a commitment to reducing its carbon footprint in line with industry standards. The emissions data is not cascaded from any parent company, indicating that Chipbond Technology Corporation independently reports its emissions and climate commitments.
Unlock detailed emissions data
Access structured emissions data, company-specific emission factors, and source documents
| 2021 | 2022 | 2023 | 2024 | |
|---|---|---|---|---|
| Scope 1 | 10,897,330.1 | 00,000,000.0 | 0,000,000.0 | 0,000,000.0 |
| Scope 2 | 160,414,356.6 | 000,000,000 | 00,000,000.0 | 00,000,000 |
| Scope 3 | 41,252,802.6 | 00,000,000.0 | 0,000,000.0 | 0,000,000.0 |
Industry emissions intensity
Location emissions intensity
Reduction initiatives & disclosure networks
Companies disclose and commit to reducing emissions to show they are serious about reducing emissions impact over time. They can also help a company track its progress over time.
Chipbond Technology Corporation is not participating in any of the initiatives that we track. This may change over time as the company engages with new initiatives or updates its commitments. DitchCarbon will update this information as it becomes available.
