Public Profile

Chipbond Technology Corporation

Chipbond Technology Corporation, headquartered in Taiwan (TW), is a leading player in the semiconductor industry, specialising in advanced packaging and testing services. Founded in 1997, the company has established itself as a key provider of innovative solutions for integrated circuits, particularly in the areas of flip chip and wafer-level packaging. With a strong presence in major operational regions across Asia, Chipbond is renowned for its commitment to quality and technological advancement. The company’s core offerings include high-performance semiconductor packaging and testing services, which are distinguished by their reliability and efficiency. Chipbond's strategic focus on research and development has positioned it as a trusted partner for global clients, contributing to its notable achievements in the competitive semiconductor market. As a result, Chipbond Technology Corporation continues to drive innovation and excellence in the ever-evolving landscape of semiconductor technology.

DitchCarbon Score

How does Chipbond Technology Corporation's carbon action stack up? DitchCarbon scores companies based on their carbon action and commitment to reducing emissions. Read about our methodology to learn more.

22

Industry Average

Mean score of companies in the Communication Equipment Manufacturing industry. Comparing a company's score to the industry average can give you a sense of how well the company is doing compared to its peers.

24

Industry Benchmark

Chipbond Technology Corporation's score of 22 is lower than 74% of the industry. This can give you a sense of how well the company is doing compared to its peers.

26%

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Chipbond Technology Corporation's reported carbon emissions

Chipbond Technology Corporation, headquartered in Taiwan (TW), currently does not have publicly available carbon emissions data for recent years. As a result, specific figures regarding their Scope 1, 2, or 3 emissions are not provided. Additionally, there are no documented reduction targets or climate pledges outlined in their initiatives. In the absence of concrete emissions data, it is essential to note that many companies in the technology sector are increasingly focusing on sustainability and climate commitments. This includes setting science-based targets and engaging in initiatives aimed at reducing their carbon footprint. Chipbond Technology Corporation may be participating in similar industry trends, although specific details are not available at this time.

Industry emissions intensity

Very low
Low
Medium
High
Very high
Some industries are more carbon intensive than others. Chipbond Technology Corporation's primary industry is Radio, television and communication equipment and apparatus (32), which is very low in terms of carbon intensity compared to other industries.

Location emissions intensity

Very low
Low
Medium
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Very high
The carbon intensity of the energy grid powering a company's primary operations has a strong influence on its overall carbon footprint. This request for Chipbond Technology Corporation is in TW, which we do not have grid emissions data for.

Reduction initiatives & disclosure networks

Companies disclose and commit to reducing emissions to show they are serious about reducing emissions impact over time. They can also help a company track its progress over time.

Chipbond Technology Corporation is not participating in any of the initiatives that we track. This may change over time as the company engages with new initiatives or updates its commitments. DitchCarbon will update this information as it becomes available.

Science Based Targets Initiative
Carbon Disclosure Project
The Climate Pledge
UN Global Compact
RE 100
Climate Action 100
Race To Net Zero
Reduction Actions

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Where does DitchCarbon data come from?

Discover our data-driven methodology for measuring corporate climate action and benchmarking against industry peers