Tongfu Microelectronics Co.,Ltd

Tongfu Microelectronics Co.,Ltd., widely recognised as TFME, stands as a leading global provider of integrated circuit (IC) packaging and testing services. Established in 1997 and headquartered in Nantong, Jiangsu, China, the company has strategically expanded its operational footprint with facilities across China and Southeast Asia, including Malaysia and Singapore. TFME is a critical player within the radio, television, and communication equipment and apparatus industry.

Specialising in comprehensive semiconductor packaging and testing solutions, TFME delivers a unique 'one-stop service' encompassing everything from wafer bumping through to final test. This includes advanced packaging technologies such as Flip Chip, FC-BGA, WLCSP, and SIP, alongside traditional packages for a diverse range of applications. Listed on the Shenzhen Stock Exchange since 2007, TFME significantly bolstered its market position in 2016 by acquiring AMD's Malaysian and Suzhou plants.

This strategic growth firmly places TFME among the world's top semiconductor packaging and testing companies, known for its commitment to innovation in microelectronics. Their expertise in high-reliability packaging and testing drives advancements across various electronic devices.