Carsem (M) Sdn Bhd, a leading provider in the semiconductor packaging and testing industry, is headquartered in Malaysia. Established in 1972, the company has grown to become a key player in the global market, with significant operations across Asia and beyond. Carsem is renowned for its innovative packaging solutions and advanced testing services, catering to a diverse range of sectors including automotive, consumer electronics, and telecommunications. With a commitment to quality and efficiency, Carsem offers a unique portfolio of products, including advanced flip chip and ball grid array packages. The company has achieved notable milestones, such as ISO certification and recognition for its sustainable practices, solidifying its position as a trusted partner in the semiconductor supply chain. Carsem continues to lead the industry with its cutting-edge technology and customer-centric approach.
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